Showing results 5 to 24 of 46
< previous
next >
| Issue Date | Title | Author(s) |
| 2022 | Behaviour of printed resistors compatible with thick film copper technology | Hlína, Jiří; Řeboun, Jan; Hamáček, Aleš |
| 2021 | Characterization of printed thermistors | Janda, Martin; Syrový, Tomáš; Pretl, Silvan; Vik, Robert; Řeboun, Jan |
| 2018 | Charakterizace tištěných senzorů vlhkosti | Šlauf, Josef; Řeboun, Jan |
| 2020 | Contacting of SMD components on the textile substrates | Kalaš, David; Suchý, Stanislav; Kalčík, Jan; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš |
| 2020 | Copper-filled vias made by thick printed copper technology | Hlína, Jiří; Řeboun, Jan; Michal, David; Hamáček, Aleš |
| 2007 | Creating of thin film sensor layer by electropolymerization | Blecha, Tomáš; Hamáček, Aleš; Řeboun, Jan |
| 2023 | Development of the diagnostic tools for the COMPASS-U tokamak and plans for the first plasma | Weinzettl, Vladimír; Bílková, Petra; Ďuran, Ivan; Hron, Martin; Pánek, Radomír; Markovič, Tomáš; Varavin, Mykyta; Cavalier, Jordan; Kovařík, Karel; Torres, André; Matveeva, Ekaterina; Böhm, Petr; Ficker, Ondřej; Horáček, Jan; Čeřovský, Jaroslav; Zajac, Jaromír; Adámek, Jiří; Dimitrova, Miglena; Imríšek, Martin; Sos, Miroslav; Tomešová, Eva; Vondráček, Petr; Mikszuta-Michalik, Katarzyna; Svoboda, Jakub; Naydenkova, Diana; Bogár, Klára; Caloud, Jakub; Ivanov, Vladislav; Lukeš, Samuel; Podolník, Aleš; Bogár, Ondřej; Entler, Slavomír; Havránek, Aleš; Preinhaelter, Josef; Jaulmes, Fabien; Dejarnac, Renaud; Balner, Vojtěch; Veselovský, Viktor; Bělina, Pavel; Král, Miroslav; Gerardin, Jonathan; Vlček, Jiří; Tadros, Momtaz; Turjanica, Pavel; Kindl, Vladimír; Řeboun, Jan; Rowan, William; Houshmandyar, Saeid; Scholz, Marek; Bielecki, Jakub; Makowski, Dariusz; Chernyshova, Maryna; Cipciar, Dario |
| 2022 | Effect of the gate electrode/electrolyte interface on OECT performance | Šlauf, Josef; Řeboun, Jan |
| 2022 | Examination of Wet Assembling Methods in Printed Flexible Electronics | Janda, Martin; Pretl, Silvan; Michal, David; Řeboun, Jan |
| 2021 | FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymers | Kalaš, David; Šíma, Karel; Kadlec, Petr; Polanský, Radek; Soukup, Radek; Řeboun, Jan; Hamáček, Aleš |
| 2021 | In-situ monitoring method for curing of pastes used in printed electronics | Janda, Martin; Pretl, Silvan; Řeboun, Jan |
| 2022 | Interconnecting embroidered hybrid conductive yarns by ultrasonic plastic welding for e-textiles | Dils, Christian; Kalaš, David; Řeboun, Jan; Suchý, Stanislav; Soukup, Radek; Moravcová, Daniela; Krshiwoblozki, Malte; Schneider-Ramelow, Martin |
| 2020 | Interconnection of terminals on flexible substrates with printed conductive patterns | Řeboun, Jan; Kalaš, David; Michal, David; Hlína, Jiří |
| 2018 | Kontaktní struktury na textilních substrátech | Michal, David; Řeboun, Jan |
| 2022 | Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles | Janda, Martin; Rostás, Kateřina; Pretl, Silvan; Řeboun, Jan |
| 2007 | Mikroskop LEXT a jeho využití v materiálových vědách | Řeboun, Jan; Hamáček, Aleš |
| 2020 | Nezbytnost objektivního měření dosažené léčebné komprese - nové patofyziologické úvahy a informace o terapii | Resl, Vladimír; Drobičková, Klára; Bláhová, Eliška; Soukup, Radek; Leba, Martin; Blecha, Tomáš; Řeboun, Jan |
| 2023 | Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials | Kalaš, David; Soukup, Radek; Řeboun, Jan; Radouchová, Michaela; Rous, Pavel; Hamáček, Aleš |
| 2020 | Optimization of contacting technological process on printed conductive pattern for wearable electronics | Benešová, Andrea; Hirman, Martin; Hlína, Jiří; Tupa, Jiří; Steiner, František; Řeboun, Jan |
| 2020 | Orientation of carbon nanotubes using electric field for applications of electrochemical sensors | Šlauf, Josef; Pavec, Martin; Řeboun, Jan |
