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dc.contributor.authorBeshajová Pelikánová, I.
dc.contributor.authorMočička, J.
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2016-12-14T09:59:31Z
dc.date.available2016-12-14T09:59:31Z
dc.date.issued2016
dc.identifier.citationElectroscope. 2016, č. 3.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://hdl.handle.net/11025/22035
dc.format3 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rightsCopyright © 2015 Electroscope. All Rights Reserved.en
dc.subjectelektronikacs
dc.subjectpastycs
dc.subjectteplotacs
dc.subjectelectronicsen
dc.subjectpastesen
dc.subjecttemperatureen
dc.titleThe viscosity thermal dependence of paste material for electronicsen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThe work is focused on properties of paste materials for electronics. Soldering pastes and pastes for screen printing were tested. The dynamic viscosity dependencies of pastes were analyzed. Viscosity of paste strongly affected the result of technological process. Viscosity is changed with temperature. Mentioned pastes belong to non Newtonian fluids. That means that viscosity of pastes is changed with shear rate too. Viscosity dependence on temperature increasing from room temperature to 50°C approximately was measured for chosen samples. Differences between viscosity of paste at room temperature and viscosity at storage temperature in refrigerator were determined too. Dial viscometer HBT type was used for viscosity measurement. Viscometer was equipped by measuring system with geometrical configuration cone – plate and system with standard disc spindle.en
dc.type.statusPeer-revieweden
Appears in Collections:Číslo 3 (2016) - IMAPS flash Conference 2016
Číslo 3 (2016) - IMAPS flash Conference 2016

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