| Title: | Adheze a pájitelnost TPC substrátů v závislosti na koncentraci kyslíku ve vypalovacím procesu |
| Other Titles: | Adhesion and solderability of TPC substrates at different oxygen level in firing process |
| Authors: | Hlína, Jiří Řeboun, Jan Hamáček, Aleš |
| Citation: | FIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 3.-4. listopadu 2016. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2016, s. [70-74]. |
| Issue Date: | 2016 |
| Publisher: | Západočeská univerzita v Plzni |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://hdl.handle.net/11025/26507 |
| ISBN: | 978–80–261–0516–9 |
| Keywords: | tlustý film;měď;oxid hlinitý;adheze;pájitelnost |
| Keywords in different language: | thick film;copper;alumina;adhesion;solderability |
| Abstract in different language: | This paper is focused on an adhesion and solderability measuring of samples prepared by TPC (Thick Printed Copper) technology. The TPC technology is used for power electronic substrate manufacturing. Copper film is screen printed on alumina substrate and fired in nitrogen atmosphere. Oxygen level dependence on adhesion of copper film to alumina base and copper film solderability was observed in the paper. |
| Rights: | © Západočeská univerzita v Plzni |
| Appears in Collections: | Konferenční příspěvky / Conference papers (KET) 2016 2016 |
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