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Results 1-10 of 14 (Search time: 0.005 seconds).
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Issue Date
Title
Author(s)
2019
Reliability of printed power resistor with thick-film copper terminals
Hlína, Jiří
;
Řeboun, Jan
;
Johan, Jan
;
Šimonovský, Marek
;
Hamáček, Aleš
2019
Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Džugan, Tomáš
;
Hamáček, Aleš
2019
Study of co-fired multilayer structures based on Thick Printed Copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Heřmanský, Vojtěch
;
Šimonovský, Marek
;
Johan, Jan
;
Hamáček, Aleš
2019
Optimization of the photodynamic inactivation of prions by a phthalocyanine photosensitizer: The crucial involvement of singlet oxygen
Kostelanská, Marie
;
Freisleben, Jaroslav
;
Bačkovská Hanusová, Zdeňka
;
Moško, Tibor
;
Vik, Robert
;
Moravcová, Daniela
;
Hamáček, Aleš
;
Mosinger, Jiří
;
Holada, Karel
2020
Study of copper thick film metallization on aluminum nitride
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2020
Fast AHRS filter for accelerometer, magnetometer and gyroscope combination with separated sensor correstions
Justa, Josef
;
Šmídl, Václav
;
Hamáček, Aleš
2020
Fully printed disposable IoT soil moisture sensors for precision agriculture
Syrový, Tomáš
;
Vik, Robert
;
Pretl, Silvan
;
Syrová, Lucie
;
Čengery, Jiří
;
Hamáček, Aleš
;
Kubáč, Lubomír
;
Menšík, Ladislav
2021
An electrochemical amperometric ethylene sensor with solid polymer electrolyte based on ionic liquid
Kuberský, Petr
;
Navrátil, Jiří
;
Syrový, Tomáš
;
Sedlák, Petr
;
Nešpůrek, Stanislav
;
Hamáček, Aleš
2022
Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper
Hlína, Jiří
;
Řeboun, Jan
;
Šimonovský, Marek
;
Syrový, Tomáš
;
Janda, Martin
;
Hamáček, Aleš
2021
Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
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electrical properties
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ceramics
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