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Fakulta elektrotechnická / Faculty of Electrical Engineering
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Title
Author(s)
2019
Study of co-fired multilayer structures based on Thick Printed Copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Heřmanský, Vojtěch
;
Šimonovský, Marek
;
Johan, Jan
;
Hamáček, Aleš
2020
Study of copper thick film metallization on aluminum nitride
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2019
Testing the applicability of LDPE/HNT composites for cable core insulation
Polanský, Radek
;
Kadlec, Petr
;
Slepička, Petr
;
Kolská, Zdeňka
;
Švorčík, Václav
2022
Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper
Hlína, Jiří
;
Řeboun, Jan
;
Šimonovský, Marek
;
Syrový, Tomáš
;
Janda, Martin
;
Hamáček, Aleš
2021
Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
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Hamáček, Aleš
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Hlína, Jiří
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Řeboun, Jan
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copper
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ceramics
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broadband dielectric spectroscopy...
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