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Results 1-4 of 4 (Search time: 0.008 seconds).
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Title
Author(s)
2019
Study of co-fired multilayer structures based on Thick Printed Copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Heřmanský, Vojtěch
;
Šimonovský, Marek
;
Johan, Jan
;
Hamáček, Aleš
2020
Study of copper thick film metallization on aluminum nitride
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2022
Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper
Hlína, Jiří
;
Řeboun, Jan
;
Šimonovský, Marek
;
Syrový, Tomáš
;
Janda, Martin
;
Hamáček, Aleš
2021
Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
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4
Hlína, Jiří
4
Řeboun, Jan
2
Šimonovský, Marek
1
Heřmanský, Vojtěch
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3
copper
2
ceramics
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nickel
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contact resistance
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