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DC poleHodnotaJazyk
dc.contributor.authorSítko, Vladimír
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2019-02-20T11:20:41Z-
dc.date.available2019-02-20T11:20:41Z-
dc.date.issued2018
dc.identifier.citationElectroscope. 2018, č. 1.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2018/Cislo1_2018/r12c1c6.pdf
dc.identifier.urihttp://hdl.handle.net/11025/31001
dc.format3 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rightsCopyright © 2018 Electroscope. All Rights Reserved.en
dc.subjectelektronické sestavycs
dc.subjectčistící procescs
dc.subjectoptické měřenícs
dc.subjectměření iontové kontaminacecs
dc.titleMethod for qualification cleaning of electronic assemblies, validation of process changes in cleaning processen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThe described experiment was designed to verify and demonstrate current situation in determining cleanliness of electronic assemblies with leadless and high dense components. We have compared the historically introduced method of ionic contamination measuring with new optical method of determining flux residues under component with very thin gap. It should be interpreted as a confirmation of just released Addendum of IPC J STD 001 standard, which definitely state, that ionic contamination measurement ( ROSE method) cannot give an objective evidence of cleanliness of SMT electronic assembly and prediction of reliability.en
dc.subject.translatedelectronic assembliesen
dc.subject.translatedcleaning processen
dc.subject.translatedoptical measurementen
dc.subject.translatedionic contamination measurementen
dc.type.statusPeer-revieweden
Vyskytuje se v kolekcích:Číslo 1 (2018)
Číslo 1 (2018)

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