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Electroscope
Ročník 2019
Číslo 2 (2019)
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Results 1-10 of 19 (Search time: 0.007 seconds).
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Issue Date
Title
Author(s)
2019
Nonstandard unidirectional lamination for Face down technology
Lenger, T.
;
Pietriková, A.
;
Livovský, Ľ
2019
Smart sensors – another foundation for Industry 4.0
Hurban, M.
;
Szendiuch, I.
2019
The Nonconductive Sputtered Thin Film Layer
Beshajová Pelikánová, I.
;
Vaněk, P.
2019
Fast process detection of the chemical elements
Novák, Lukáš
;
Šteffan, Pavel
2019
Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution
Sorokina, Kristina
;
Bušek, David
;
Dušek, Karel
2019
Optimization of apertures shapes in stencil for eca printing to connecting of smd components on pcbs
Hirman, M.
;
Steiner, F.
2019
Development of Low-Cost Solder Paste Hand Dispenser
Veselý, P.
;
Dušek, K.
;
Bušek, D.
;
Sedláček, J.
;
Bortel, R.
;
Hospodka, J.
2019
Energy consumption optimization for thermal energy harvester applications
Teplý, T.
;
Janíček, V.
;
Bouřa, A.
;
Novák, J.
;
Husák, M.
2019
IoT applications utilizing excess heat in electrical lighting fixtures
Novák, J.
;
Janíček, V.
;
Teplý, T.
;
Bouřa, A.
;
Husák, M.
;
Foit, J.
2019
Thermoelectric generator in low thermal gradient operation
Znbill, Z.
;
Boušek, J.
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internet of things
4
internet věcí
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