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DC poleHodnotaJazyk
dc.contributor.authorLenger, T.
dc.contributor.authorPietriková, A.
dc.contributor.authorLivovský, Ľ
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2020-02-25T08:33:14Z
dc.date.available2020-02-25T08:33:14Z
dc.date.issued2019
dc.identifier.citationElectroscope. 2019, č. 2.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c11.pdf
dc.identifier.urihttp://hdl.handle.net/11025/36521
dc.format4 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.rightsCopyright © 2019 Electroscope. All Rights Reserved.en
dc.subjectmechanické vlastnosti materiálůcs
dc.subjectanalýzacs
dc.subjectface down technologycs
dc.subject3-bodový ohybový testcs
dc.titleNonstandard unidirectional lamination for Face down technologyen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis research is focused on analysing mechanical properties of materials which can be used for lamination of multilayer PCBs with embedded components by face down technology. Mechanical properties were analysed by 3-point bend test on various types of substrate material. Materials with low Tg and high Tg was used for testing. Laminate material, laminated prepreg material and also sandwich structure (combination of prepreg and laminate material) was tested. Lamination of prepreg materials was done by one step lamination and also by two step lamination. Sandwich structure has great potential for the purpose of components embedding and miniaturization of PCBs (Printed Circuit Boards) by face down technology.en
dc.subject.translatedmechanical properties of materialsen
dc.subject.translatedanalysisen
dc.subject.translatedface down technologyen
dc.subject.translated3-point bend testen
dc.type.statusPeer-revieweden
Vyskytuje se v kolekcích:Číslo 2 (2019)
Číslo 2 (2019)

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