Title: Properties of thick printed copper films on alumina substrates
Authors: Hlína, Jiří
Řeboun, Jan
Hamáček, Aleš
Citation: HLÍNA, J., ŘEBOUN, J., HAMÁČEK, A. Properties of thick printed copper films on alumina substrates. In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/. Piscataway: IEEE, 2019. s. 1-5. ISBN 978-1-7281-1874-1 , ISSN 2161-2528.
Issue Date: 2019
Publisher: IEEE
Document type: konferenční příspěvek
URI: 2-s2.0-85072295975
ISBN: 978-1-7281-1874-1
ISSN: 2161-2528
Keywords in different language: alumina;thick film;electrical parameters;copper
Abstract in different language: This paper is focused on the properties of Thick Printed Copper (TPC) films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on electrical, mechanical and thermal properties of these films. The changes of these properties depending on the thickness of TPC films are described in this paper.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/36553

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