| Title: | Advanced application capabilities of thick printed copper technology |
| Authors: | Hlína, Jiří Řeboun, Jan Johan, Jan Hamáček, Aleš |
| Citation: | HLÍNA, J., ŘEBOUN, J., JOHAN, J., HAMÁČEK, A. Advanced application capabilities of thick printed copper technology. In: Proceedings of the 22nd Microelectronics and Packaging Conference (EMPC 2019). Piscataway: IEEE, 2019. s. 1-5. ISBN 978-0-9568086-6-0. |
| Issue Date: | 2019 |
| Publisher: | IEEE |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | 2-s2.0-85078827997 http://hdl.handle.net/11025/36780 |
| ISBN: | 978-0-9568086-6-0 |
| Keywords in different language: | thick printed copper;TPC;power electronic substrates;alumina;multilayer structures |
| Abstract: | This paper is focused on the advanced capabilities of Thick Printed Copper (TPC) technology used for power electronic substrate manufacturing. TPC technology is based on screen printing of special copper pastes on ceramic substrates and its firing in a nitrogen atmosphere. This technology can be used as an alternative solution to conventional metallization techniques such as DBC or AMB and enables wide-range interconnection capabilities which cannot be realized with these conventional techniques. TPC interconnection capabilities include multilayer structures, copper plated vias and integrated passive components. Parameters and reliability of above-mentioned TPC structures after accelerated aging and thermal shock cycling are described in this paper. |
| Rights: | Plný text není přístupný. © IEEE |
| Appears in Collections: | Konferenční příspěvky / Conference papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD |
Files in This Item:
| File | Size | Format | |
|---|---|---|---|
| Post-02 _ Jiri Hlina.pdf | 1,21 MB | Adobe PDF | View/Open Request a copy |
Please use this identifier to cite or link to this item:
http://hdl.handle.net/11025/36780Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.