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DC poleHodnotaJazyk
dc.contributor.authorŘeboun, Jan
dc.contributor.authorKalaš, David
dc.contributor.authorMichal, David
dc.contributor.authorHlína, Jiří
dc.date.accessioned2021-03-08T11:00:19Z-
dc.date.available2021-03-08T11:00:19Z-
dc.date.issued2020
dc.identifier.citationŘEBOUN, J. KALAŠ, D. MICHAL, D. HLÍNA, J. Interconnection of terminals on flexible substrates with printed conductive patterns. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscataway: IEEE, 2020. s. 1-5. ISBN 978-1-72816-773-2 , ISSN 2161-2528.cs
dc.identifier.isbn978-1-72816-773-2
dc.identifier.issn2161-2528
dc.identifier.uri2-s2.0-85087623332
dc.identifier.urihttp://hdl.handle.net/11025/42802
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseriesProceedings of the International Spring Seminar on Electronics Technology, ISSE 2020en
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.titleInterconnection of terminals on flexible substrates with printed conductive patternsen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper presents research focused on realisation and the testing of wire to Ag printed pad interconnections realised on flexible substrates. The research was concentrated mainly on the development of highly reliable resistance spot welded interconnection technology. The mechanically crimped contacts on the same test patterns were also realised for the comparison purposes. Realised interconnections were deeply tested in terms of 4-wire contact resistance measurement before, during and after climatic ageing. Two different flexible substrates and three wire finish metals (Cu, Sn, Ag) were used for the resistance spot welding process. The changes of test samples contact resistance during the dry heat test and damp heat test are described in the paper. It can be concluded that the resistance spot welding process can produce high reliable interconnections between wires and Ag printed terminals on flexible substrates. This technology is scalable to mass production, is low cost and properties of realised interconnections are comparable to conventional crimped interconnections.en
dc.subject.translatedageingen
dc.subject.translatedcontact resistanceen
dc.subject.translatedcopperen
dc.subject.translatedcrimpingen
dc.subject.translatedelectrical contactsen
dc.subject.translatedfailure analysisen
dc.subject.translatedprinted circuit manufactureen
dc.subject.translatedreliabilityen
dc.subject.translatedsilveren
dc.subject.translatedspot weldingen
dc.subject.translatedwires (electric)en
dc.identifier.doi10.1109/ISSE49702.2020.9120956
dc.type.statusPeer-revieweden
dc.identifier.obd43929895
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
Vyskytuje se v kolekcích:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)
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