Title: | In-situ monitoring method for curing of pastes used in printed electronics |
Authors: | Janda, Martin Pretl, Silvan Řeboun, Jan |
Citation: | JANDA, M. PRETL, S. ŘEBOUN, J. In-situ monitoring method for curing of pastes used in printed electronics. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7 |
Issue Date: | 2021 |
Publisher: | IEEE |
Document type: | konferenční příspěvek ConferenceObject |
URI: | 2-s2.0-85113934387 http://hdl.handle.net/11025/49727 |
ISBN: | 978-1-66541-477-7 |
Keywords in different language: | printed electronics;conductive paste;dispensing;curing |
Abstract: | In this paper, a method for in-situ monitoring of curing of materials for printed electronics applications is introduced. Materials for printed electronics in form of inks and pastes need to be cured after printing. Curing is an important post-printing process. Curing is often done at elevated temperatures. The presented method includes a printable layout for conductive inks. The layout represents a large-area application and can be easily inspected by microscopy. The method also includes a specially designed holding frame that holds samples in the air and connects them to the measuring device. During curing the electrical resistance of the printed layout is measured. Presented results show that the curing process can be optimized by changing curing parameters like temperature and time, which is critical for substrates with low heat resistance. |
Abstract in different language: | In this paper, a method for in-situ monitoring of curing of materials for printed electronics applications is introduced. Materials for printed electronics in form of inks and pastes need to be cured after printing. Curing is an important post-printing process. Curing is often done at elevated temperatures. The presented method includes a printable layout for conductive inks. The layout represents a large-area application and can be easily inspected by microscopy. The method also includes a specially designed holding frame that holds samples in the air and connects them to the measuring device. During curing the electrical resistance of the printed layout is measured. Presented results show that the curing process can be optimized by changing curing parameters like temperature and time, which is critical for substrates with low heat resistance. |
Rights: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
Appears in Collections: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD |
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Please use this identifier to cite or link to this item:
http://hdl.handle.net/11025/49727
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