Title: | Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles |
Authors: | Janda, Martin Rostás, Kateřina Pretl, Silvan Řeboun, Jan |
Citation: | JANDA, M. ROSTÁS, K. PRETL, S. ŘEBOUN, J. Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles. In 2022 45th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2022. s. 1-6. ISBN: 978-1-66546-589-2 , ISSN: 2161-2536 |
Issue Date: | 2022 |
Publisher: | IEEE |
Document type: | konferenční příspěvek ConferenceObject |
URI: | 2-s2.0-85134243182 http://hdl.handle.net/11025/49769 |
ISBN: | 978-1-66546-589-2 |
ISSN: | 2161-2536 |
Keywords in different language: | printed electronics;embroidered electronics;micro-dispensing |
Abstract: | This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed. |
Abstract in different language: | This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed. |
Rights: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
Appears in Collections: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD |
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