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DC poleHodnotaJazyk
dc.contributor.authorJanda, Martin
dc.contributor.authorRostás, Kateřina
dc.contributor.authorPretl, Silvan
dc.contributor.authorŘeboun, Jan
dc.date.accessioned2022-10-24T10:00:10Z-
dc.date.available2022-10-24T10:00:10Z-
dc.date.issued2022
dc.identifier.citationJANDA, M. ROSTÁS, K. PRETL, S. ŘEBOUN, J. Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles. In 2022 45th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2022. s. 1-6. ISBN: 978-1-66546-589-2 , ISSN: 2161-2536cs
dc.identifier.isbn978-1-66546-589-2
dc.identifier.issn2161-2536
dc.identifier.uri2-s2.0-85134243182
dc.identifier.urihttp://hdl.handle.net/11025/49769
dc.description.abstractThis paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.en
dc.format6 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseries2022 45th International Spring Seminar on Electronics Technology : /proceedings/en
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.titleMethod of Connecting Printed and Embroidered Conductive Paths in Smart Textilesen
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.en
dc.subject.translatedprinted electronicsen
dc.subject.translatedembroidered electronicsen
dc.subject.translatedmicro-dispensingen
dc.identifier.doi10.1109/ISSE54558.2022.9812714
dc.type.statusPeer-revieweden
dc.identifier.document-number853642200006
dc.identifier.obd43936454
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
Vyskytuje se v kolekcích:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
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