Title: Behaviour of printed resistors compatible with thick film copper technology
Authors: Hlína, Jiří
Řeboun, Jan
Hamáček, Aleš
Citation: HLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Behaviour of printed resistors compatible with thick film copper technology. In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings. Piscataway: IEEE, 2022. s. 228-232. ISBN: 978-1-66548-947-8
Issue Date: 2022
Publisher: IEEE
Document type: konferenční příspěvek
URI: 2-s2.0-85143147862
ISBN: 978-1-66548-947-8
Keywords in different language: thick film;copper;nickel;paste;ink;ceramic;resistor
Abstract in different language: This paper is focused on printed resistors compatible with Thick Printed Copper (TPC). TPC technology is new prospective technology for the realization of power electronic substrates and can be used as an alternative to conventional Direct Bonded Copper or Active Metal Brazing technologies. TPC technology has many benefits and also enables the direct integration of printed resistors on a power substrate. Three variants of printed resistors based on different resistive materials (standard resistive thick film paste, copper-nickel nanoparticle ink and copper-nickel thick film paste) were verified and tested. The properties of these resistors are described in this paper.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference Papers (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/50935

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