Title: | Properties of 3D LTCC structure inteconnections |
Authors: | Nicák, Michal Psota, Boleslav Kosina, Petr Starý, Jiří Šandera, Josef |
Citation: | Electroscope. 2012, č. 6, EDS 2012. |
Issue Date: | 2012 |
Publisher: | Západočeská univerzita v Plzni, Fakulta elektrotechnická |
Document type: | konferenční příspěvek conferenceObject |
URI: | http://hdl.handle.net/11025/1044 http://147.228.94.30/images/PDF/Rocnik2012/Cislo6_2012/r6c6c3.pdf |
ISSN: | 1802-4564 |
Keywords: | nízkoteplotně vypalovaná keramika;substráty;3D pájené spoje |
Keywords in different language: | low temperature co-fired ceramic;substrates;3D soldered interconnections |
Abstract in different language: | This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting “zero shrink” Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching. |
Rights: | © 2012 Electroscope. All rights reserved. |
Appears in Collections: | Číslo 6 - EDS 2012 (2012) Číslo 6 - EDS 2012 (2012) |
Files in This Item:
File | Description | Size | Format | |
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r6c6c3.pdf | 1,25 MB | Adobe PDF | View/Open |
Please use this identifier to cite or link to this item:
http://hdl.handle.net/11025/1044
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