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dc.contributor.authorNavrátil, Jiří
dc.contributor.editorFiřt, Jaroslav
dc.date.accessioned2017-11-13T12:32:09Z
dc.date.available2017-11-13T12:32:09Z
dc.date.issued2016
dc.identifier.citationFIŘT, Jaroslav ed. Elektrotechnika a informatika: XVIII. ročník konference doktorských prací Zámek Nečtiny, 3.-4. listopadu 2016. Vyd. 1. Plzeň: Západočeská univerzita v Plzni, 2016, s. [110-114].cs
dc.identifier.isbn978–80–261–0516–9
dc.identifier.urihttp://hdl.handle.net/11025/26515
dc.format4 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isocscs
dc.publisherZápadočeská univerzita v Plznics
dc.rights© Západočeská univerzita v Plznics
dc.subjectAerosol Jetcs
dc.subjectbondovánícs
dc.subjecttištěná elektronikacs
dc.subjectSMDcs
dc.titleAerosol Jet® bondování SMD součástekcs
dc.title.alternativeAerosol Jet® SMD components bondingen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper presents a research focused on Aerosol Jet® bonding of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies the new possibilities have raised. Except for using conductive adhesives the Aerosol Jet® technology can be used for contacting.en
dc.subject.translatedAerosol Jeten
dc.subject.translatedbondingen
dc.subject.translatedprinted electronicsen
dc.subject.translatedSMDen
dc.type.statusPeer-revieweden
Appears in Collections:Konferenční příspěvky / Conference papers (KET)
2016
2016

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