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Results 1-10 of 13 (Search time: 0.005 seconds).
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Issue Date
Title
Author(s)
2019
Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Džugan, Tomáš
;
Hamáček, Aleš
2019
Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Hirman, Martin
;
Steiner, František
2019
Relationship of soldering profile, voids, formation and strength of soldered joints
Steiner, František
;
Wirth, Václav
;
Hirman, Martin
2019
Requirements for education 4.0 and study programs within industry 4.0
Benešová, Andrea
;
Hirman, Martin
;
Steiner, František
;
Tupa, Jiří
2019
Bend testing of SMD chip resistors glued on flexible substrates
Hirman, Martin
;
Neuhöfer, Tomáš
;
Steiner, František
2019
Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate
Hirman, Martin
;
Steiner, František
;
Navrátil, Jiří
;
Hamáček, Aleš
2019
Project management during the industry 4.0 implementation with risk factor analysis
Hirman, Martin
;
Benešová, Andrea
;
Steiner, František
;
Tupa, Jiří
2019
Reliability of glued joints on flexible substrates during accelerated current ageing
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Hamáček, Aleš
2019
Determination of changes in process management within industry
Benešová, Andrea
;
Hirman, Martin
;
Steiner, František
;
Tupa, Jiří
2020
Influence of production and operating conditions on properties of acrylic conformal coatings
Steiner, František
;
Hirman, Martin
;
Rous, Pavel
;
Hornak, Jaroslav
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Authors
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Keywords
Type
Author
5
Hamáček, Aleš
5
Navrátil, Jiří
4
Benešová, Andrea
4
Tupa, Jiří
.
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Subject
3
ageing
3
electrically conductive adhesive
3
flexible substrate
3
industry 4.0
.
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Type
11
conferenceObject
11
konferenční příspěvek
2
article
2
článek
.
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Date issued
4
2020
9
2019