Název:	Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Autoři:	Hirman, Martin Steiner, František
Citace zdrojového dokumentu:	HIRMAN, M., STEINER, F. Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs. Electroscope, 2019, roč. 2019, č. 2, s. 1-6. ISSN 1802-4564.
Datum vydání:	2019
Nakladatel:	Západočeská univerzita v Plzni
Typ dokumentu:	článek article
URI:	http://hdl.handle.net/11025/36648
ISSN:	1802-4564
Klíčová slova v dalším jazyce:	stencil printing;stencil aperture;electrically conductive adhesive;printing optimization
Abstrakt v dalším jazyce:	This paper deals with the influence of different apertures shape in stencil on mechanical shear strength, electrical resistance and insulation distance. In the experiment, the SMD chip components 0805 were assembled on flexible substrate by electrically conductive adhesives (MG 8331S, CA 3150). Six different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. The half of samples was measured directly (electrical resistance, mechanical strength and insulation distance) and second half of samples was submitted to the accelerated ageing test (85°C/85%RH/16hrs) and then tested the same way. The results shows that it is appropriate to choose other aperture shape in stencil than standard rectangular shape.
Práva:	© Západočeská univerzita v Plzni
Vyskytuje se v kolekcích:	Články / Articles (RICE) Články / Articles (KET) OBD

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