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Fakulta elektrotechnická / Faculty of Electrical Engineering
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Results 1-10 of 19 (Search time: 0.006 seconds).
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Issue Date
Title
Author(s)
2012
Usage of inert atmosphere for solderability testing
Novák, Tomáš
;
Machač, Jan
;
Steiner, František
2012
Multiplexer for automatic testing of multimedia units
Rendl, Karel
;
Blecha, Tomáš
;
Herc, Ladislav
;
Klocker, Lukáš
;
Linhart, Richard
;
Sehnal, Petr
;
Steiner, František
;
Wirth, Václav
2010
Effect of thermal stress and constitution of lead-free soldering alloys on creation and growth of IMC
Novák, Tomáš
;
Steiner, František
2018
Slovo úvodem - IMAPS flash Conference 2018
Steiner, František
2019
Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrate
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Džugan, Tomáš
;
Hamáček, Aleš
2019
Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs
Hirman, Martin
;
Steiner, František
2019
Relationship of soldering profile, voids, formation and strength of soldered joints
Steiner, František
;
Wirth, Václav
;
Hirman, Martin
2019
Requirements for education 4.0 and study programs within industry 4.0
Benešová, Andrea
;
Hirman, Martin
;
Steiner, František
;
Tupa, Jiří
2019
Bend testing of SMD chip resistors glued on flexible substrates
Hirman, Martin
;
Neuhöfer, Tomáš
;
Steiner, František
2019
Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate
Hirman, Martin
;
Steiner, František
;
Navrátil, Jiří
;
Hamáček, Aleš
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Type
Author
13
Hirman, Martin
5
Hamáček, Aleš
5
Navrátil, Jiří
5
Tupa, Jiří
.
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Subject
4
industry 4.0
4
risk management
3
ageing
3
electrically conductive adhesive
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Type
14
conferenceObject
14
konferenční příspěvek
6
article
6
článek
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Date issued
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2020
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2019
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