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Results 1-8 of 8 (Search time: 0.006 seconds).
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Issue Date
Title
Author(s)
2019
Reliability of printed power resistor with thick-film copper terminals
Hlína, Jiří
;
Řeboun, Jan
;
Johan, Jan
;
Šimonovský, Marek
;
Hamáček, Aleš
2019
Study of co-fired multilayer structures based on Thick Printed Copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Heřmanský, Vojtěch
;
Šimonovský, Marek
;
Johan, Jan
;
Hamáček, Aleš
2020
Study of copper thick film metallization on aluminum nitride
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2022
Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper
Hlína, Jiří
;
Řeboun, Jan
;
Šimonovský, Marek
;
Syrový, Tomáš
;
Janda, Martin
;
Hamáček, Aleš
2021
Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2022
Study of Internal Stress in Conductive and Dielectric Thick Films
Hlína, Jiří
;
Řeboun, Jan
;
Janda, Martin
;
Hamáček, Aleš
2022
Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons
Hirman, Martin
;
Navrátil, Jiří
;
Steiner, František
;
Řeboun, Jan
;
Soukup, Radek
;
Hamáček, Aleš
2023
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials
Kalaš, David
;
Soukup, Radek
;
Řeboun, Jan
;
Radouchová, Michaela
;
Rous, Pavel
;
Hamáček, Aleš
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6
Hlína, Jiří
3
Šimonovský, Marek
2
Janda, Martin
2
Johan, Jan
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4
electrical properties
3
ceramics
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copper
2
nickel
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2023
3
2022
1
2021
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2020
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