Title: Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials
Authors: Kalaš, David
Soukup, Radek
Řeboun, Jan
Radouchová, Michaela
Rous, Pavel
Hamáček, Aleš
Citation: KALAŠ, D. SOUKUP, R. ŘEBOUN, J. RADOUCHOVÁ, M. ROUS, P. HAMÁČEK, A. Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials. Polymers, 2023, roč. 15, č. 11, s. nestránkováno. ISSN: 2073-4360
Issue Date: 2023
Publisher: MDPI
Document type: článek
URI: 2-s2.0-85161539050
ISSN: 2073-4360
Keywords in different language: interconnection technique;encapsulation;e-textile;3D printing
Abstract in different language: Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications. The realized specimens are characterized by low resistance (median 21 mW), linear voltage–current characteristics, and fluid-resistant encapsulation. The contact area is comprehensively analyzed and compared with the theoretical Holm’s model.
Rights: © The Author(s)
Appears in Collections:Články / Articles (RICE)
Články / Articles (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/53040

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