Title: Copper-filled vias made by thick printed copper technology
Authors: Hlína, Jiří
Řeboun, Jan
Michal, David
Hamáček, Aleš
Citation: HLÍNA, J. ŘEBOUN, J. MICHAL, D. HAMÁČEK, A. Copper-filled vias made by thick printed copper technology. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscaway: IEEE, 2020. s. 1-4. ISBN 978-1-72816-773-2.
Issue Date: 2020
Publisher: IEEE
Document type: konferenční příspěvek
URI: 2-s2.0-85087613754
ISBN: 978-1-72816-773-2
Keywords in different language: copper alloys;ink jet printing;interconnections;soldering;vias
Abstract in different language: This paper is focused on copper-filled vias realized by prospective Thick Printed Copper (TPC) technology. TPC technology can be used for power electronics substrate manufacturing instead of conventional metallization techniques (DBC or AMB). This technology enables the realization of complex interconnection including multilayer circuits and copper-filled vias. Process of realization and properties of copper-plated vias are described in detail in this paper.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/42797

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