Full metadata record
DC FieldValueLanguage
dc.contributor.authorMedůna, O.
dc.contributor.authorKult, J.
dc.contributor.authorŠulc, M.
dc.contributor.editorAdámek, Vítězslav
dc.contributor.editorJonášová,Alena
dc.contributor.editorPlánička, Stanislav
dc.contributor.editorZajíček, Martin
dc.date.accessioned2021-11-29T11:16:27Z
dc.date.available2021-11-29T11:16:27Z
dc.date.issued2021
dc.identifier.citationComputational mechanics 2021: book of extended abstracts: 36th conference with international participation, p. 152-154.en
dc.identifier.isbn978-80-261-1059-0
dc.identifier.urihttp://hdl.handle.net/11025/46189
dc.description.sponsorshipThis publication was supported by the Ministry of Industry and Trade (MPO) within the framework of institutional support for long-term strategic development research organization - provider MPO, recipient VÚTS, a. s.en
dc.format3 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherZápadočeská univerzita v Plznics
dc.relation.ispartofseriesComputational Mechanicsen
dc.rights©2021 University of West Bohemia, Plzeň, Czech Republicen
dc.subjectLS-DYNAcs
dc.subjectexpandovaná polypropylenová pěnacs
dc.subjectmodelovánícs
dc.subjectdeformacecs
dc.titleModeling of large deformation of the foam part using LS-DYNAen
dc.typekonferenční příspěvekcs
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.subject.translatedLS-DYNAen
dc.subject.translatedexpanded polypropylene foamen
dc.subject.translatedmodelingen
dc.subject.translateddeformationen
dc.type.statusPeer-revieweden
Appears in Collections:Computational mechanics 2021
Computational mechanics 2021

Files in This Item:
File Description SizeFormat 
CM2021_Conference_Proceedings-_uvod.pdfPlný text319,68 kBAdobe PDFView/Open
CM2021_Conference_Proceedings-162-164.pdfPlný text383,91 kBAdobe PDFView/Open


Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/46189

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.