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dc.contributor.authorJanda, Martin
dc.contributor.authorPretl, Silvan
dc.contributor.authorMichal, David
dc.contributor.authorŘeboun, Jan
dc.date.accessioned2022-10-24T10:00:10Z-
dc.date.available2022-10-24T10:00:10Z-
dc.date.issued2022
dc.identifier.citationJANDA, M. PRETL, S. MICHAL, D. ŘEBOUN, J. Examination of Wet Assembling Methods in Printed Flexible Electronics. In 2022 45th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2022. s. 1-6. ISBN: 978-1-66546-589-2 , ISSN: 2161-2536cs
dc.identifier.isbn978-1-66546-589-2
dc.identifier.issn2161-2536
dc.identifier.uri2-s2.0-85134225144
dc.identifier.urihttp://hdl.handle.net/11025/49770
dc.description.abstractThis paper examines two methods of assembling electronics SMD components on flexible substrates with low-temperature resistance. As a contact medium for interconnection between component and conductive pattern, conductive adhesive MG Chemicals 8331S-15G or conductive Ag printing paste DuPont PE 874 was used. The contact resistance of samples was measured after the assembling process and then mechanical tests were performed. Samples were subjected to a bend test and a rapid change of temperature in the shock chamber. Tests have shown that Ag paste can withstand high mechanical and temperature stress due to its stretchability and can partly return to its previous state after mechanical stress is released. On the other hand, conductive adhesive, which is rigid, tends to fail under high mechanical and temperature stress. Ag paste shows great assumptions to be used in the field of flexible or even stretchable electronics as a contact medium.en
dc.format6 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseries2022 45th International Spring Seminar on Electronics Technology : /proceedings/en
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.titleExamination of Wet Assembling Methods in Printed Flexible Electronicsen
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper examines two methods of assembling electronics SMD components on flexible substrates with low-temperature resistance. As a contact medium for interconnection between component and conductive pattern, conductive adhesive MG Chemicals 8331S-15G or conductive Ag printing paste DuPont PE 874 was used. The contact resistance of samples was measured after the assembling process and then mechanical tests were performed. Samples were subjected to a bend test and a rapid change of temperature in the shock chamber. Tests have shown that Ag paste can withstand high mechanical and temperature stress due to its stretchability and can partly return to its previous state after mechanical stress is released. On the other hand, conductive adhesive, which is rigid, tends to fail under high mechanical and temperature stress. Ag paste shows great assumptions to be used in the field of flexible or even stretchable electronics as a contact medium.en
dc.subject.translatedflexible printed electronicsen
dc.subject.translatedconductive adhesiveen
dc.subject.translatedmicro-dispensingen
dc.identifier.doi10.1109/ISSE54558.2022.9812763
dc.type.statusPeer-revieweden
dc.identifier.document-number853642200013
dc.identifier.obd43936455
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
Vyskytuje se v kolekcích:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
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