Název: Higher Temperature Washing of Electrically Connected SMD Components onto the Textile Ribbons
Autoři: Hirman, Martin
Navrátil, Jiří
Steiner, František
Hamáček, Aleš
Citace zdrojového dokumentu: HIRMAN, M. NAVRÁTIL, J. STEINER, F. HAMÁČEK, A. Higher Temperature Washing of Electrically Connected SMD Components onto the Textile Ribbons. In 2022 45th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2022. s. 1-5. ISBN: 978-1-66546-589-2 , ISSN: 2161-2536
Datum vydání: 2022
Nakladatel: IEEE
Typ dokumentu: konferenční příspěvek
ConferenceObject
URI: 2-s2.0-85134268267
http://hdl.handle.net/11025/49773
ISBN: 978-1-66546-589-2
ISSN: 2161-2536
Klíčová slova v dalším jazyce: non-conductive adhesive;smart textiles;conductive ribbon;soldering on textile;higher temperature washing
Abstrakt: This article addresses the higher temperature washing reliability research of interconnection technique for mounting SMD (surface mounted device) components onto conductive stretchable textile ribbons. It can be concluded that both tested interconnection technologies (i.e. low-temperature soldering and adhesive bonding) have some pros and cons, and both technologies are usable for dedicated applications. The results for soldered samples are better and stable for both tested washing temperatures 60°C and 92°C and are suitable especially for power supply applications or heating. The adhesive bonded joints have acceptable results only for 60°C washing temperature and are suitable for sensors, illumination, data transfer applications, or components with multiple leads. The research also shows that prepared joints have higher endurance than the whole ribbon.
Abstrakt v dalším jazyce: This article addresses the higher temperature washing reliability research of interconnection technique for mounting SMD (surface mounted device) components onto conductive stretchable textile ribbons. It can be concluded that both tested interconnection technologies (i.e. low-temperature soldering and adhesive bonding) have some pros and cons, and both technologies are usable for dedicated applications. The results for soldered samples are better and stable for both tested washing temperatures 60°C and 92°C and are suitable especially for power supply applications or heating. The adhesive bonded joints have acceptable results only for 60°C washing temperature and are suitable for sensors, illumination, data transfer applications, or components with multiple leads. The research also shows that prepared joints have higher endurance than the whole ribbon.
Práva: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
© IEEE
Vyskytuje se v kolekcích:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
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