Title: Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles
Authors: Hirman, Martin
Hamerník, Karel
Kalaš, David
Navrátil, Jiří
Moravcová, Daniela
Steiner, František
Citation: HIRMAN, M. HAMERNÍK, K. KALAŠ, D. NAVRÁTIL, J. MORAVCOVÁ, D. STEINER, F. Real-Life Functional Tests of Conductive Joints of SMD Components on E-Textiles. In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC 2022) : proceedings. Piscataway: IEEE, 2022. s. 223-227. ISBN: 978-1-66548-947-8
Issue Date: 2022
Publisher: IEEE
Document type: konferenční příspěvek
URI: 2-s2.0-85143149276
ISBN: 978-1-66548-947-8
Keywords in different language: soldering;electrically conductive adhesive bonding (ECA);non-conductive adhesive bonding (NCA);thermocompression;electrically conductive textile stretchable ribbons;functional tests;sports jersey e-textile
Abstract in different language: This article addresses the real-life functional research of electrically conductive joints of SMD components onto the electrically conductive textile stretchable ribbons. The four different connection techniques were used in the research: soldering, electrically conductive adhesive bonding, thermocompression, and non-conductive adhesive bonding. The 20 weeks of testing, including periodical weight training and washing, were realized. It can be concluded that soldering and both adhesive bonding technique are usable. The results showed that the electrical resistance of soldered samples was stable for the whole testing time and can be recommended. The results also showed that the electrical resistance of both adhesive bonded samples was growing at the first few testing cycles and stabilized for the rest many weeks of testing. It follows that also these adhesive bonding techniques can be recommended for some applications where the higher (but stable) joints resistance is acceptable.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference Papers (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/50936

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