Title:	Meranie teplotného profilu v prostredí nasýtených pár
Authors:	Livovský, Ľubomír Pietriková, Alena
Citation:	Electroscope. 2009, č. 2, výběr z konference Diagnostika.
Issue Date:	2009
Publisher:	Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type:	konferenční příspěvek conferenceObject
URI:	http://147.228.94.30/images/PDF/Rocnik2009/cislo2_2009_Diagnostika/r3c2c1.pdf http://hdl.handle.net/11025/543
ISSN:	1802-4564
Keywords:	nasycená pára;měření teplotního profilu;desky plošných spojů
Keywords in different language:	printed circuit boards;temperature profile measurement;saturated steam
Abstract in different language:	The process of soldering has to guarantee suitable temperature conditions for formation of metallurgical joint between leads of components and conductive pads on printed circuit board. The formation of reliable and quality joint depends on temperature profile, which guarantees transformation of solid alloy into “molten metal” and consecutive reformation of solid alloy. The alloy finally acts a conductive joint. The process is controlled by the temperature profile, which defines temperature change vs. time. The temperature profile is specified to form reliable joint. Recommendations for measurement of the temperature profile are presented in IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". The recommendations in IPC-7530 for mass soldering assume application of solder wave or reflow oven (solder paste reflow). This article is aimed at obtaining experience with solder paste reflow in developed machine, which works on principleof saturated vapours condensation (VPS - Vapour Phase Soldering).
Rights:	Copyright © 2007-2010 Electroscope. All Rights Reserved.
Appears in Collections:	Číslo 2 - výběr z konference Diagnostika (2009) Číslo 2 - výběr z konference Diagnostika (2009)

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