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dc.contributor.authorPietriková, Alena
dc.contributor.authorLivovský, Ľubomír
dc.contributor.authorĎurišin, Juraj
dc.contributor.editorPihera, Josef
dc.contributor.editorSteiner, František
dc.date.accessioned2012-10-17T11:15:34Z
dc.date.available2012-10-17T11:15:34Z
dc.date.issued2009
dc.identifier.citationElectroscope. 2009, č. 2, výběr z konference Diagnostika.cs
dc.identifier.issn1802-4564
dc.identifier.urihttp://147.228.94.30/images/PDF/Rocnik2009/cislo2_2009_Diagnostika/r3c2c5.pdf
dc.identifier.urihttp://hdl.handle.net/11025/546
dc.format4 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isosksk
dc.publisherZápadočeská univerzita v Plzni, Fakulta elektrotechnickács
dc.relation.ispartofseriesElectroscopecs
dc.rightsCopyright © 2007-2010 Electroscope. All Rights Reserved.en
dc.subjectpájené spojecs
dc.subjectintermetalické slitinycs
dc.subjectSACcs
dc.titleSledovanie štruktúr spojov na báze zliatiny SACsk
dc.typečlánekcs
dc.typekonferenční příspěvekcs
dc.typearticleen
dc.typeconferenceObjecten
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedIntermetallic compounds (IMCs) are essential part of lead-free solders microstructure. Presence of the IMCs results from solidification process of molten solder. In 96.5Sn3Ag0.5Cu (SAC305) solder is dominant element tin (Sn). But despite this Sn dominancy only 3% weight contain of silver (Ag) has strong influence on final structure of solid solder joint. Ag forms in volume of the solder hard Ag3Sn intermetallics significantly influencing especially mechanical properties of the joint. Fundamental impact on strength of solder joint has also interaction between the molten (or solid) solder and printed circuit board (PCB) pad. It forms IMC containig both Sn and PCB pad material (bare copper or surface coating). Therefore analysis of presence of IMCs in the solder joint is essential key to understand behaviour of lead-free solder joints.en
dc.subject.translatedsoldered jointsen
dc.subject.translatedintermetallic alloysen
dc.subject.translatedSACen
dc.type.statusPeer-revieweden
Appears in Collections:Číslo 2 - výběr z konference Diagnostika (2009)
Číslo 2 - výběr z konference Diagnostika (2009)

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