Title:	Sledovanie štruktúr spojov na báze zliatiny SAC
Authors:	Pietriková, Alena Livovský, Ľubomír Ďurišin, Juraj
Citation:	Electroscope. 2009, č. 2, výběr z konference Diagnostika.
Issue Date:	2009
Publisher:	Západočeská univerzita v Plzni, Fakulta elektrotechnická
Document type:	článek konferenční příspěvek article conferenceObject
URI:	http://147.228.94.30/images/PDF/Rocnik2009/cislo2_2009_Diagnostika/r3c2c5.pdf http://hdl.handle.net/11025/546
ISSN:	1802-4564
Keywords:	pájené spoje;intermetalické slitiny;SAC
Keywords in different language:	soldered joints;intermetallic alloys;SAC
Abstract in different language:	Intermetallic compounds (IMCs) are essential part of lead-free solders microstructure. Presence of the IMCs results from solidification process of molten solder. In 96.5Sn3Ag0.5Cu (SAC305) solder is dominant element tin (Sn). But despite this Sn dominancy only 3% weight contain of silver (Ag) has strong influence on final structure of solid solder joint. Ag forms in volume of the solder hard Ag3Sn intermetallics significantly influencing especially mechanical properties of the joint. Fundamental impact on strength of solder joint has also interaction between the molten (or solid) solder and printed circuit board (PCB) pad. It forms IMC containig both Sn and PCB pad material (bare copper or surface coating). Therefore analysis of presence of IMCs in the solder joint is essential key to understand behaviour of lead-free solder joints.
Rights:	Copyright © 2007-2010 Electroscope. All Rights Reserved.
Appears in Collections:	Číslo 2 - výběr z konference Diagnostika (2009) Číslo 2 - výběr z konference Diagnostika (2009)

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