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Results 11-20 of 42 (Search time: 0.005 seconds).
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Issue DateTitleAuthor(s)
2019Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrateHirman, Martin; Steiner, František; Navrátil, Jiří; Hamáček, Aleš
2019Advanced application capabilities of thick printed copper technologyHlína, Jiří; Řeboun, Jan; Johan, Jan; Hamáček, Aleš
2019Temperature modulated field effect in organic electrochemical transistor with ionic liquidsMaračková, Lucie; Pospíšil, Jan; Mraček, Lukáš; Syrový, Tomáš; Hamáček, Aleš; Zmeškal, Oldřich
2020Study of copper thick film metallization on aluminum nitrideHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2019The testing of brass solderability for hybrid sewing threadPavec, Martin; Hirman, Martin; Soukup, Radek; Hamáček, Aleš
2019Reliability of glued joints on flexible substrates during accelerated current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2020Contacting of SMD components on the textile substratesKalaš, David; Suchý, Stanislav; Kalčík, Jan; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš
2020E-textile piano fabricated using several textile technologiesKosť, Lukáš; Pavec, Martin; Michal, David; Moravcová, Daniela; Soukup, Radek; Hamáček, Aleš
2020Copper-filled vias made by thick printed copper technologyHlína, Jiří; Řeboun, Jan; Michal, David; Hamáček, Aleš
2020Fast AHRS filter for accelerometer, magnetometer and gyroscope combination with separated sensor correstionsJusta, Josef; Šmídl, Václav; Hamáček, Aleš
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