Title: Contacting of SMD components on the textile substrates
Authors: Kalaš, David
Suchý, Stanislav
Kalčík, Jan
Řeboun, Jan
Soukup, Radek
Hamáček, Aleš
Citation: KALAŠ, D. SUCHÝ, S. KALČÍK, J. ŘEBOUN, J. SOUKUP, R. HAMÁČEK, A. Contacting of SMD components on the textile substrates. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscataway: IEEE, 2020. s. 1-6. ISBN 978-1-72816-773-2 , ISSN 2161-2528.
Issue Date: 2020
Publisher: IEEE
Document type: konferenční příspěvek
URI: 2-s2.0-85087637378
ISBN: 978-1-72816-773-2
ISSN: 2161-2528
Keywords in different language: electrical conductivity;melting;surface mount technology;textile industry;textile technology;textiles
Abstract in different language: This paper deals with contacting of the standard electrical SMD components on the textile substrates. SMD components are contacted and also encapsulated in one single step by a thermo-compress method. SMD components are embedded and fixed in the cavities of the plastic housing made by 3D printer. This housing is subsequently melted by the standard thermo-transfer device, which is used in textile industry for pattern transfer. The electrically conductive track can be embroidered by a conductive hybrid thread directly on the textile or printed by conductive ink on the housing.
Rights: Plný text je přístupný v rámci univerzity přihlášeným uživatelům.
Appears in Collections:Konferenční příspěvky / Conference papers (RICE)
Konferenční příspěvky / Conference papers (KET)

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Please use this identifier to cite or link to this item: http://hdl.handle.net/11025/42803

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