Title:	Contacting of SMD components on the textile substrates
Authors:	Kalaš, David Suchý, Stanislav Kalčík, Jan Řeboun, Jan Soukup, Radek Hamáček, Aleš
Citation:	KALAŠ, D. SUCHÝ, S. KALČÍK, J. ŘEBOUN, J. SOUKUP, R. HAMÁČEK, A. Contacting of SMD components on the textile substrates. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscataway: IEEE, 2020. s. 1-6. ISBN 978-1-72816-773-2 , ISSN 2161-2528.
Issue Date:	2020
Publisher:	IEEE
Document type:	konferenční příspěvek conferenceObject
URI:	2-s2.0-85087637378 http://hdl.handle.net/11025/42803
ISBN:	978-1-72816-773-2
ISSN:	2161-2528
Keywords in different language:	electrical conductivity;melting;surface mount technology;textile industry;textile technology;textiles
Abstract in different language:	This paper deals with contacting of the standard electrical SMD components on the textile substrates. SMD components are contacted and also encapsulated in one single step by a thermo-compress method. SMD components are embedded and fixed in the cavities of the plastic housing made by 3D printer. This housing is subsequently melted by the standard thermo-transfer device, which is used in textile industry for pattern transfer. The electrically conductive track can be embroidered by a conductive hybrid thread directly on the textile or printed by conductive ink on the housing.
Rights:	Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE
Appears in Collections:	Konferenční příspěvky / Conference papers (RICE) Konferenční příspěvky / Conference papers (KET) OBD

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