Title: | Contacting of SMD components on the textile substrates |
Authors: | Kalaš, David Suchý, Stanislav Kalčík, Jan Řeboun, Jan Soukup, Radek Hamáček, Aleš |
Citation: | KALAŠ, D. SUCHÝ, S. KALČÍK, J. ŘEBOUN, J. SOUKUP, R. HAMÁČEK, A. Contacting of SMD components on the textile substrates. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscataway: IEEE, 2020. s. 1-6. ISBN 978-1-72816-773-2 , ISSN 2161-2528. |
Issue Date: | 2020 |
Publisher: | IEEE |
Document type: | konferenční příspěvek conferenceObject |
URI: | 2-s2.0-85087637378 http://hdl.handle.net/11025/42803 |
ISBN: | 978-1-72816-773-2 |
ISSN: | 2161-2528 |
Keywords in different language: | electrical conductivity;melting;surface mount technology;textile industry;textile technology;textiles |
Abstract in different language: | This paper deals with contacting of the standard electrical SMD components on the textile substrates. SMD components are contacted and also encapsulated in one single step by a thermo-compress method. SMD components are embedded and fixed in the cavities of the plastic housing made by 3D printer. This housing is subsequently melted by the standard thermo-transfer device, which is used in textile industry for pattern transfer. The electrically conductive track can be embroidered by a conductive hybrid thread directly on the textile or printed by conductive ink on the housing. |
Rights: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
Appears in Collections: | Konferenční příspěvky / Conference papers (RICE) Konferenční příspěvky / Conference papers (KET) OBD |
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