Title:	Electrical resistance of solder joints on conductive ribbons
Authors:	Hirman, Martin Navrátil, Jiří Steiner, František Hamáček, Aleš
Citation:	HIRMAN, M. NAVRÁTIL, J. STEINER, F. HAMÁČEK, A. Electrical resistance of solder joints on conductive ribbons. In: Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020. Piscaway: IEEE, 2020. s. 1-5. ISBN 978-1-72816-773-2.
Issue Date:	2020
Publisher:	IEEE
Document type:	konferenční příspěvek conferenceObject
URI:	2-s2.0-85087616990 http://hdl.handle.net/11025/42805
ISBN:	978-1-72816-773-2
Keywords in different language:	adhesives;ageing;conductive adhesives;electrical resistivity;reliability;solders;tin alloys
Abstract in different language:	The paper deals with high humidity and high temperature ageing reliability of joints soldered / glued by non-conductive adhesive (NCA) onto the conductive ribbon. The prepared samples were accelerated aged at 85°C temperature and 85% RH for 1000 hours. The main goal of the experiment was to verify the possibility of using soldering to make a conductive connection of components onto the ribbon. The joints electrical resistance was measured before, during and after ageing. The results show that using of soldering to ensure the conductive connection of components onto the ribbons is suitable and reliable. Also the using of non-conductive adhesive for this connection can be possible, but this option should be more tested and a suitable temperature limit should be found.
Rights:	Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE
Appears in Collections:	Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) Konferenční příspěvky / Conference papers (KET) OBD

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