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DC poleHodnotaJazyk
dc.contributor.authorHlína, Jiří
dc.contributor.authorŘeboun, Jan
dc.contributor.authorHamáček, Aleš
dc.date.accessioned2022-01-31T11:00:30Z-
dc.date.available2022-01-31T11:00:30Z-
dc.date.issued2021
dc.identifier.citationHLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications. Materials, 2021, roč. 14, č. 22, s. 1-7. ISSN: 1996-1944cs
dc.identifier.issn1996-1944
dc.identifier.uri2-s2.0-85119903968
dc.identifier.urihttp://hdl.handle.net/11025/46692
dc.format7 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherMDPIen
dc.relation.ispartofseriesMaterialsen
dc.rights© authorsen
dc.titleStudy of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applicationsen
dc.typečlánekcs
dc.typearticleen
dc.rights.accessopenAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedThis paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 W/square and low temperature coefficient of resistance 100106 K1 values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.en
dc.subject.translatedcopperen
dc.subject.translatednickelen
dc.subject.translatedelectrical propertiesen
dc.subject.translatedthick-film resistoren
dc.subject.translatedcontact resistanceen
dc.subject.translatedresistive inken
dc.identifier.doi10.3390/ma14227039
dc.type.statusPeer-revieweden
dc.identifier.document-number724889300001
dc.identifier.obd43934516
dc.project.IDEF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligencecs
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