Full metadata record
| DC pole | Hodnota | Jazyk |
|---|---|---|
| dc.contributor.author | Hlína, Jiří | |
| dc.contributor.author | Řeboun, Jan | |
| dc.contributor.author | Hamáček, Aleš | |
| dc.date.accessioned | 2022-10-17T10:02:21Z | - |
| dc.date.available | 2022-10-17T10:02:21Z | - |
| dc.date.issued | 2021 | |
| dc.identifier.citation | HLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Properties of thick printed copper films on aluminum nitride substrates. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7 | cs |
| dc.identifier.isbn | 978-1-66541-477-7 | |
| dc.identifier.uri | 2-s2.0-85113985913 | |
| dc.identifier.uri | http://hdl.handle.net/11025/49723 | |
| dc.description.abstract | This paper is focused on the properties of Thi ck Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper. | en |
| dc.format | 5 s. | cs |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en | en |
| dc.publisher | IEEE | en |
| dc.relation.ispartofseries | 2021 44th International Spring Seminar on Electronics Technology : /proceedings/ | en |
| dc.rights | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. | cs |
| dc.rights | © IEEE | en |
| dc.title | Properties of thick printed copper films on aluminum nitride substrates | en |
| dc.type | konferenční příspěvek | cs |
| dc.type | ConferenceObject | en |
| dc.rights.access | restrictedAccess | en |
| dc.type.version | publishedVersion | en |
| dc.description.abstract-translated | This paper is focused on the properties of Thi ck Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper. | en |
| dc.subject.translated | thick film | en |
| dc.subject.translated | aluminum nitride | en |
| dc.subject.translated | TPC | en |
| dc.subject.translated | power electronics | en |
| dc.identifier.doi | 10.1109/ISSE51996.2021.9467591 | |
| dc.type.status | Peer-reviewed | en |
| dc.identifier.document-number | 853459100037 | |
| dc.identifier.obd | 43933004 | |
| dc.project.ID | EF18_069/0009855/Elektrotechnické technologie s vysokým podílem vestavěné inteligence | cs |
| dc.project.ID | FW01010067/Pokročilé keramické materiály a technologie pro výkonovou elektroniku POKER | cs |
| dc.project.ID | SGS-2021-003/Materiály, technologie a diagnostika v elektrotechnice | cs |
| Vyskytuje se v kolekcích: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD | |
Soubory připojené k záznamu:
| Soubor | Velikost | Formát | |
|---|---|---|---|
| Hlina_09467591.pdf | 4,22 MB | Adobe PDF | Zobrazit/otevřít Vyžádat kopii |
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