| Title: | Properties of thick printed copper films on aluminum nitride substrates |
| Authors: | Hlína, Jiří Řeboun, Jan Hamáček, Aleš |
| Citation: | HLÍNA, J. ŘEBOUN, J. HAMÁČEK, A. Properties of thick printed copper films on aluminum nitride substrates. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7 |
| Issue Date: | 2021 |
| Publisher: | IEEE |
| Document type: | konferenční příspěvek ConferenceObject |
| URI: | 2-s2.0-85113985913 http://hdl.handle.net/11025/49723 |
| ISBN: | 978-1-66541-477-7 |
| Keywords in different language: | thick film;aluminum nitride;TPC;power electronics |
| Abstract: | This paper is focused on the properties of Thi ck Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper. |
| Abstract in different language: | This paper is focused on the properties of Thi ck Printed Copper (TPC) films printed on aluminum nitride (AlN) substrates. TPC technology is based on thick film technology and it is predominantly intended for power substrate manufacturing. TPC films can be also printed on ceramic substrates with high thermal conductivity such as AlN and this combination enables the realization of high power substrates. The electrical and mechanical parameters and structure of TPC films on AlN substrates are described in this paper. |
| Rights: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
| Appears in Collections: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD |
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