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dc.contributor.authorJanda, Martin
dc.contributor.authorPretl, Silvan
dc.contributor.authorŘeboun, Jan
dc.date.accessioned2022-10-17T10:02:22Z-
dc.date.available2022-10-17T10:02:22Z-
dc.date.issued2021
dc.identifier.citationJANDA, M. PRETL, S. ŘEBOUN, J. In-situ monitoring method for curing of pastes used in printed electronics. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7cs
dc.identifier.isbn978-1-66541-477-7
dc.identifier.uri2-s2.0-85113934387
dc.identifier.urihttp://hdl.handle.net/11025/49727
dc.description.abstractIn this paper, a method for in-situ monitoring of curing of materials for printed electronics applications is introduced. Materials for printed electronics in form of inks and pastes need to be cured after printing. Curing is an important post-printing process. Curing is often done at elevated temperatures. The presented method includes a printable layout for conductive inks. The layout represents a large-area application and can be easily inspected by microscopy. The method also includes a specially designed holding frame that holds samples in the air and connects them to the measuring device. During curing the electrical resistance of the printed layout is measured. Presented results show that the curing process can be optimized by changing curing parameters like temperature and time, which is critical for substrates with low heat resistance.en
dc.format5 s.cs
dc.format.mimetypeapplication/pdf
dc.language.isoenen
dc.publisherIEEEen
dc.relation.ispartofseries2021 44th International Spring Seminar on Electronics Technology : /proceedings/en
dc.rightsPlný text je přístupný v rámci univerzity přihlášeným uživatelům.cs
dc.rights© IEEEen
dc.titleIn-situ monitoring method for curing of pastes used in printed electronicsen
dc.typekonferenční příspěvekcs
dc.typeConferenceObjecten
dc.rights.accessrestrictedAccessen
dc.type.versionpublishedVersionen
dc.description.abstract-translatedIn this paper, a method for in-situ monitoring of curing of materials for printed electronics applications is introduced. Materials for printed electronics in form of inks and pastes need to be cured after printing. Curing is an important post-printing process. Curing is often done at elevated temperatures. The presented method includes a printable layout for conductive inks. The layout represents a large-area application and can be easily inspected by microscopy. The method also includes a specially designed holding frame that holds samples in the air and connects them to the measuring device. During curing the electrical resistance of the printed layout is measured. Presented results show that the curing process can be optimized by changing curing parameters like temperature and time, which is critical for substrates with low heat resistance.en
dc.subject.translatedprinted electronicsen
dc.subject.translatedconductive pasteen
dc.subject.translateddispensingen
dc.subject.translatedcuringen
dc.identifier.doi10.1109/ISSE51996.2021.9467541
dc.type.statusPeer-revieweden
dc.identifier.document-number853459100011
dc.identifier.obd43933019
dc.project.IDEF16_026/0008382/Uhlíkové alotropy s racionalizovanými nanorozhraními a nanospoji pro environmentální a biomedicínské aplikacecs
dc.project.IDSGS-2021-003/Materiály, technologie a diagnostika v elektrotechnicecs
Vyskytuje se v kolekcích:Konferenční příspěvky / Conference Papers (KET)
Konferenční příspěvky / Conference papers (RICE)
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