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Issue DateTitleAuthor(s)
2020Contacting of SMD components on the textile substratesKalaš, David; Suchý, Stanislav; Kalčík, Jan; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš
2020E-textile piano fabricated using several textile technologiesKosť, Lukáš; Pavec, Martin; Michal, David; Moravcová, Daniela; Soukup, Radek; Hamáček, Aleš
2020System for testing and evaluating the thermal comfort of smart textiles clothingŠíma, Karel; Moučková, Kateřina; Hamáček, Aleš; Soukup, Radek; Komárková, Petra; Glombíková, Viera
2021FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymersKalaš, David; Šíma, Karel; Kadlec, Petr; Polanský, Radek; Soukup, Radek; Řeboun, Jan; Hamáček, Aleš
2021Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbonKalaš, David; Kalčík, Jan; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš
2021Washing resistance of textile ribbon dismountable interconnections in smart textilesŠíma, Karel; Řeboun, Jan; Moravcová, Daniela; Švecová, Lucie; Kalaš, David; Soukup, Radek; Hamáček, Aleš
2022Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbonsHirman, Martin; Navrátil, Jiří; Steiner, František; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš
2023Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer MaterialsKalaš, David; Soukup, Radek; Řeboun, Jan; Radouchová, Michaela; Rous, Pavel; Hamáček, Aleš