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Results 1-10 of 11 (Search time: 0.009 seconds).
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Issue DateTitleAuthor(s)
2007Implementace bezolovnaté technologie pájení v elektronické výroběSteiner, František; Hamáček, Aleš; Skočil, Vlastimil
2007Použití laseru při výrobě microvia substrátůSteiner, František; Hamáček, Aleš; Tupa, Jiří
2019Alternative technology for SMD components connection by non‑conductive adhesive on a flexible substrateHirman, Martin; Navrátil, Jiří; Steiner, František; Džugan, Tomáš; Hamáček, Aleš
2020Comparison of conductive ribbons reliability during electrical current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2019Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrateHirman, Martin; Steiner, František; Navrátil, Jiří; Hamáček, Aleš
2019Reliability of glued joints on flexible substrates during accelerated current ageingHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2020Electrical resistance of solder joints on conductive ribbonsHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2020Effect of washing cycles on glued conductive joints used on stretchable smart textile ribbonsHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2020Reliability of glued SMD components on smart textileHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
2022Higher Temperature Washing of Electrically Connected SMD Components onto the Textile RibbonsHirman, Martin; Navrátil, Jiří; Steiner, František; Hamáček, Aleš
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