Log In
Search
Search:
All of DSpace
Publikační činnost / Publications
Fakulta aplikovaných věd / Faculty of Applied Sciences
Fakulta designu a umění Ladislava Sutnara / Ladislav Sutnar Faculty of Design and Art
Fakulta ekonomická / Faculty of Economy
Fakulta elektrotechnická / Faculty of Electrical Engineering
Fakulta filozofická / Faculty of Philosophy and Art
Fakulta pedagogická / Faculty of Education
Fakulta právnická / Faculty of Law
Fakulta strojní / Faculty of Mechanical Engineering
Fakulta zdravotnických studií / Faculty of Health Care Studies
Nové technologie - výzkumné centrum / New Technologies - Research Centre
Ústav jazykové přípravy / Institute of applied language studies
OBD
OpenAire
for
Current filters:
Title
Author
Subject
Date Issued
Type
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Title
Author
Subject
Date Issued
Type
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Title
Author
Subject
Date Issued
Type
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Start a new search
Add filters:
Use filters to refine the search results.
Title
Author
Subject
Date Issued
Type
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Results 1-10 of 13 (Search time: 0.007 seconds).
previous
1
2
next
Item hits:
Issue Date
Title
Author(s)
2020
Study of copper thick film metallization on aluminum nitride
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2020
Contacting of SMD components on the textile substrates
Kalaš, David
;
Suchý, Stanislav
;
Kalčík, Jan
;
Řeboun, Jan
;
Soukup, Radek
;
Hamáček, Aleš
2020
Copper-filled vias made by thick printed copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Michal, David
;
Hamáček, Aleš
2022
Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper
Hlína, Jiří
;
Řeboun, Jan
;
Šimonovský, Marek
;
Syrový, Tomáš
;
Janda, Martin
;
Hamáček, Aleš
2021
FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymers
Kalaš, David
;
Šíma, Karel
;
Kadlec, Petr
;
Polanský, Radek
;
Soukup, Radek
;
Řeboun, Jan
;
Hamáček, Aleš
2021
Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2022
Study of Internal Stress in Conductive and Dielectric Thick Films
Hlína, Jiří
;
Řeboun, Jan
;
Janda, Martin
;
Hamáček, Aleš
2022
Behaviour of printed resistors compatible with thick film copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2021
Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon
Kalaš, David
;
Kalčík, Jan
;
Řeboun, Jan
;
Soukup, Radek
;
Hamáček, Aleš
2021
Washing resistance of textile ribbon dismountable interconnections in smart textiles
Šíma, Karel
;
Řeboun, Jan
;
Moravcová, Daniela
;
Švecová, Lucie
;
Kalaš, David
;
Soukup, Radek
;
Hamáček, Aleš
search
in repository
in collection
navigation
DSpace at University of West Bohemia
browse
Communities and Collections
Authors
Titles
Keywords
Type
Author
7
Hlína, Jiří
6
Soukup, Radek
5
Kalaš, David
2
Janda, Martin
.
next >
Subject
4
copper
3
electrical properties
3
nickel
3
thick film
.
next >
Type
7
article
7
článek
6
konferenční příspěvek
4
ConferenceObject
.
next >
Date issued
1
2023
4
2022
5
2021
3
2020
.
next >