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Results 1-10 of 13 (Search time: 0.004 seconds).
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Issue DateTitleAuthor(s)
2019Reliability of printed power resistor with thick-film copper terminalsHlína, Jiří; Řeboun, Jan; Johan, Jan; Šimonovský, Marek; Hamáček, Aleš
2019Study of co-fired multilayer structures based on Thick Printed Copper technologyHlína, Jiří; Řeboun, Jan; Heřmanský, Vojtěch; Šimonovský, Marek; Johan, Jan; Hamáček, Aleš
2019Properties of thick printed copper films on alumina substratesHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2019Advanced application capabilities of thick printed copper technologyHlína, Jiří; Řeboun, Jan; Johan, Jan; Hamáček, Aleš
2020Study of copper thick film metallization on aluminum nitrideHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2020Copper-filled vias made by thick printed copper technologyHlína, Jiří; Řeboun, Jan; Michal, David; Hamáček, Aleš
2020Interconnection of terminals on flexible substrates with printed conductive patternsŘeboun, Jan; Kalaš, David; Michal, David; Hlína, Jiří
2020Optimization of contacting technological process on printed conductive pattern for wearable electronicsBenešová, Andrea; Hirman, Martin; Hlína, Jiří; Tupa, Jiří; Steiner, František; Řeboun, Jan
2022Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copperHlína, Jiří; Řeboun, Jan; Šimonovský, Marek; Syrový, Tomáš; Janda, Martin; Hamáček, Aleš
2021Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applicationsHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
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