| Title: | Vlastnosti vícevrstvých TPC struktur |
| Other Titles: | Properties of multilayer TPC structures |
| Authors: | Hlína, Jiří Řeboun, Jan Hamáček, Aleš |
| Citation: | Elektrotechnika a informatika 2018: XIX. ročník konference doktorských prací, Zámek Nečtiny, 25. – 26. října 2018: Elektrotechnika, Elektronika, Elektroenergetika, 2018, s. 35-39. |
| Issue Date: | 2018 |
| Publisher: | Západočeská univerzita v Plzni |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://hdl.handle.net/11025/30698 |
| ISBN: | 978–80–261–0785–9 |
| Keywords: | alumina;měď;vícevrstvá struktura;tlustá vrstva |
| Keywords in different language: | alumina;copper;multilayer structure;thick film |
| Abstract in different language: | This paper is focused on multilayer Thick Printed Copper (TPC) structures on alumina substrates and the testing of their mechanical and electrical properties. Multilayer thick printed copper is a new prospective technology based on sequential printing of copper and dielectric films and their firing in an inert atmosphere. It can be used for power electronics substrate manufacturing. These substrates are used in special applications such as concentrated photovoltaics, smart power modules etc. Adhesion and electrical parameters such as capacity, dielectric constant, resistivity, breakdown voltage, dielectric strength etc. before and after thermal cycling and aging are mentioned in this paper. |
| Appears in Collections: | Konferenční příspěvky / Conference papers (KET) 2018 2018 |
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