| Title: | Kontaktování SMD součástek na flexibilní DPS s pomocí nevodivých lepidel |
| Other Titles: | Connection of SMD Components on a Flexible PCB by Non-Conductive Adhesive |
| Authors: | Navrátil, Jiří Hirman, Martin |
| Citation: | Elektrotechnika a informatika 2018: XIX. ročník konference doktorských prací, Zámek Nečtiny, 25. – 26. října 2018: Elektrotechnika, Elektronika, Elektroenergetika, 2018, s. 120-124. |
| Issue Date: | 2018 |
| Publisher: | Západočeská univerzita v Plzni |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://hdl.handle.net/11025/30719 |
| ISBN: | 978–80–261–0785–9 |
| Keywords: | elektricky vodivé lepidlo;flexibilní podklady;nevodivé lepidlo |
| Keywords in different language: | electrically conductive adhesive;flexible substrates;Nonconductive adhesive |
| Abstract in different language: | The paper deals with the connection of SMD chip resistors on the flexible substrate by electrically conductive and non-conductive adhesives. UV curable non-conductive adhesive and epoxy non-conductive adhesive were used in the experiment. The target of the experiment proved that the connection of component with substrate by non-conductive adhesive is possible and could be used as a replacement of electrically conductive adhesives in some applications. |
| Appears in Collections: | Konferenční příspěvky / Conference papers (KET) 2018 2018 |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Navratil.pdf | Plný text | 445,69 kB | Adobe PDF | View/Open |
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