Title: Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles
Authors: Rochala, Patrick
Hofmann, Christian
Kroll, Martin
Wiemer, Maik
Kräusel, Verena
Citation: Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 85-86.
Issue Date: 2021
Publisher: Faculty of Electrical Engineering, University of West Bohemia
Document type: conferenceObject
konferenčí příspěvek
URI: http://hdl.handle.net/11025/45801
ISBN: 978-80-261-0930-3
Keywords: indukční vazba;balení na úrovni čipů;FE simulace
Keywords in different language: induction bonding;chip-level packaging;FE simulation
Abstract in different language: A new induction based sintering process for chip level bonding of power electronics components is presented in which silver particles containing pastes are used as bonding material. Using finite element methods, the bonding process was analyzed and optimized so that efficient sintering of the particles could be achieved in subsequent heating and bonding tests. Therefore, the process has great potential for application in the industrial production of electronic components.
Rights: © IEEE
Appears in Collections:UIE 2021
UIE 2021

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