| Title: | Chip-level bonding for microelectronic components by induction sintering of micro structured Ag particles |
| Authors: | Rochala, Patrick Hofmann, Christian Kroll, Martin Wiemer, Maik Kräusel, Verena |
| Citation: | Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 85-86. |
| Issue Date: | 2021 |
| Publisher: | Faculty of Electrical Engineering, University of West Bohemia |
| Document type: | conferenceObject konferenčí příspěvek |
| URI: | http://hdl.handle.net/11025/45801 |
| ISBN: | 978-80-261-0930-3 |
| Keywords: | indukční vazba;balení na úrovni čipů;FE simulace |
| Keywords in different language: | induction bonding;chip-level packaging;FE simulation |
| Abstract in different language: | A new induction based sintering process for chip level bonding of power electronics components is presented in which silver particles containing pastes are used as bonding material. Using finite element methods, the bonding process was analyzed and optimized so that efficient sintering of the particles could be achieved in subsequent heating and bonding tests. Therefore, the process has great potential for application in the industrial production of electronic components. |
| Rights: | © IEEE |
| Appears in Collections: | UIE 2021 UIE 2021 |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Proceeding_2021_final-85-86.pdf | Plný text | 1,07 MB | Adobe PDF | View/Open |
| uvod_tiraz_obsah.pdf | Plný text | 2,04 MB | Adobe PDF | View/Open |
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