Title: Modeling of the heat transfer in the switchboard cabinet
Authors: Kohout, Jan
Šroubová, Lenka
Citation: Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 125-126.
Issue Date: 2021
Publisher: Faculty of Electrical Engineering, University of West Bohemia
Document type: konferenční příspěvek
URI: http://hdl.handle.net/11025/45821
ISBN: 978-80-261-0930-3
Keywords: rozvaděčová skříň;přenos tepla;simulace
Keywords in different language: switchboard cabinet;heat transfer;simulation
Abstract in different language: This paper deals with the modeling of a heat transfer in the switchboard cabinet by using the COMSOL Multiphysics software. The heat transfer field distribution can be seen from a typical example and discussion of its results. Furthermore, the results of simulations and performed measurements are compared for the selected cooling variant.
Rights: © IEEE
Appears in Collections:Konferenční příspěvky / Conference Papers (KEP)
UIE 2021
UIE 2021

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