| Title: | Modeling of the heat transfer in the switchboard cabinet |
| Authors: | Kohout, Jan Šroubová, Lenka |
| Citation: | Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 125-126. |
| Issue Date: | 2021 |
| Publisher: | Faculty of Electrical Engineering, University of West Bohemia |
| Document type: | konferenční příspěvek conferenceObject |
| URI: | http://hdl.handle.net/11025/45821 |
| ISBN: | 978-80-261-0930-3 |
| Keywords: | rozvaděčová skříň;přenos tepla;simulace |
| Keywords in different language: | switchboard cabinet;heat transfer;simulation |
| Abstract in different language: | This paper deals with the modeling of a heat transfer in the switchboard cabinet by using the COMSOL Multiphysics software. The heat transfer field distribution can be seen from a typical example and discussion of its results. Furthermore, the results of simulations and performed measurements are compared for the selected cooling variant. |
| Rights: | © IEEE |
| Appears in Collections: | Konferenční příspěvky / Conference Papers (KEP) UIE 2021 UIE 2021 |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Proceeding_2021_final-123-126-3-4.pdf | Plný text | 950,9 kB | Adobe PDF | View/Open |
| uvod_tiraz_obsah.pdf | Plný text | 2,04 MB | Adobe PDF | View/Open |
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