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Fakulta elektrotechnická / Faculty of Electrical Engineering
Katedra aplikované elektroniky a telekomunikací / Department of Applied Electronics and Telecommunications
Katedra elektroenergetiky / Department of Electrical Power Engineering
Katedra elektroenergetiky a ekologie / Department of Electrical Power Engineering and Environmental Engineering
Katedra elektromechaniky a výkonové elektroniky / Department of Electromechanical Engineering and Power Electronics
Katedra elektroniky a informačních technologií / Department of Electronics and Information Technology
Katedra elektrotechniky a počítačového modelování / Department of Electrical Engineering and Computer Modeling
Katedra materiálů a technologií / Department of Materials and Technologies
Katedra technologií a měření / Department of Technologies and Measurement
Katedra teoretické elektrotechniky / Department of Electrical Engineering Theory
Katedra výkonové elektroniky a strojů / Department of Power Electronics and Machines
Publikace FEL / Publications of FEL
Regionální inovační centrum elektrotechniky / Regional Innovation Center for Electrical Engineering
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Results 1-10 of 13 (Search time: 0.006 seconds).
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Issue Date
Title
Author(s)
2018
Vlastnosti vícevrstvých TPC struktur
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2016
Adheze a pájitelnost TPC substrátů v závislosti na koncentraci kyslíku ve vypalovacím procesu
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2019
Reliability of printed power resistor with thick-film copper terminals
Hlína, Jiří
;
Řeboun, Jan
;
Johan, Jan
;
Šimonovský, Marek
;
Hamáček, Aleš
2019
Study of co-fired multilayer structures based on Thick Printed Copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Heřmanský, Vojtěch
;
Šimonovský, Marek
;
Johan, Jan
;
Hamáček, Aleš
2019
Properties of thick printed copper films on alumina substrates
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2019
Advanced application capabilities of thick printed copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Johan, Jan
;
Hamáček, Aleš
2020
Study of copper thick film metallization on aluminum nitride
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
2020
Copper-filled vias made by thick printed copper technology
Hlína, Jiří
;
Řeboun, Jan
;
Michal, David
;
Hamáček, Aleš
2022
Study of new nitrogen-fireable copper-nickel thick film paste formulation compatible with thick printed copper
Hlína, Jiří
;
Řeboun, Jan
;
Šimonovský, Marek
;
Syrový, Tomáš
;
Janda, Martin
;
Hamáček, Aleš
2021
Study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
Hlína, Jiří
;
Řeboun, Jan
;
Hamáček, Aleš
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3
Johan, Jan
3
Šimonovský, Marek
2
Janda, Martin
1
Heřmanský, Vojtěch
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Subject
7
copper
6
thick film
4
alumina
4
electrical properties
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7
konferenční příspěvek
6
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6
článek
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3
2022
2
2021
2
2020
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2019
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